Three-dimensional printing additive manufacturing of high-thermal-conductivity diamond/SiC ceramic with complex structure for liquid cooling application

The exponential growth of artificial intelligence, high-performance computing, and next-generation electronic systems is rapidly pushing power densities beyond the limits of conventional thermal management solutions. At DIASEMI, addressing these challenges requires not only materials with ultra-high thermal conductivity, but also the ability to engineer complex three-dimensional architectures that maximize heat transfer efficiency under liquid cooling conditions.

Diamond remains the ultimate thermal conductor, with intrinsic thermal conductivity exceeding 2000 W/m·K. However, traditional diamond-based composites—particularly diamond/metal systems—are fundamentally constrained by interfacial incompatibility, poor wettability, and long-term reliability issues. DIASEMI has identified diamond/SiC ceramic composites as a superior alternative, leveraging the excellent thermal conductivity of SiC, its close thermal expansion match with diamond, and the formation of robust, thermally efficient interfaces.

To unlock the full potential of this material system, DIASEMI has developed a proprietary manufacturing approach that integrates binder jet three-dimensional printing (3DP) with liquid silicon infiltration (LSI). This hybrid process overcomes the geometric limitations of conventional fabrication techniques, enabling the direct formation of complex, high-surface-area internal architectures such as triply periodic minimal surface (TPMS) flow channels. These structures significantly enhance fluid-solid interaction, improving convective heat transfer while maintaining structural integrity.

By precisely engineering bimodal powder systems with ultra-high diamond loading (up to 80 vol%) and optimizing infiltration conditions to suppress graphitization and minimize residual silicon, DIASEMI achieves diamond/SiC composites with a unique combination of high thermal conductivity, mechanical robustness, and corrosion resistance. This platform establishes a scalable and economically viable pathway for manufacturing next-generation liquid cooling components, positioning DIASEMI at the forefront of advanced thermal management solutions for data centers, AI infrastructure, and high-power electronics.