Working Instruction for Disco DGP8761 Thinning Machine

DGP8761 Wafer grinding chuck table, wafer carrier , grinding wheels are by CERAMERIC SEMIXICON

Applicable to precision thinning of semiconductor wafers and similar materials.

1. Equipment Preparation

1.1 Environmental Check

• Ensure cleanroom conditions: temperature 22 ± 2°C, humidity 45–60%.

• Verify no vibration sources nearby; airflow must be stable.

• Confirm availability of electrical supply     (200V/3-phase) and compressed air (0.5 MPa).

1.2 Equipment Startup and Initialization

• Turn on the main power switch and start the control PC.

• Run system self-check via touchscreen: “System   Check”.

• Confirm normal function of:

• Vacuum system

• Coolant circulation       (use ultrapure water or specified coolant)

• Pneumatic pressure

1.3 Consumables and Tooling Preparation

• Grinding Wheel:      Mount the specified  SEMIXICON diamond wheel (e.g., #2000 for fine grinding). Ensure no damage and tighten securely.

• Carrier:      Clean the SEMIXICON vacuum chuck; check flatness of the ceramic plate.

• Coolant:      Ensure the filtration system is clear; coolant level adequate (recommend Disco F-GR300 series).

• Wafers:      Front side must be taped with UV film, free from burrs, bubbles, or  contamination.

2. Processing Procedure (Example: Single Wafer Thinning)

Step 1: Wafer Loading

• Place the wafer cassette onto the load port.

Step 2: Process Recipe Setup

• Select a predefined recipe from the control  panel. Key parameters include:

Tip:

·         Rough Grinding: Use low-grit wheels (#320–#800).

·         Fine Grinding: Use high-grit wheels (#2000+).

·         Some applications may also require dry polish wheels.

Step 3: Thinning Process Execution

• Click “Start” to begin automatic sequence:

1. Rough Grinding:

• High feed rate to quickly remove material.

• Leave a 10–20 µm margin for fine grinding.

2. Fine Grinding:

• Reduced feed rate to achieve target thickness and   surface finish (Ry < 0.13 µm).

3. Polishing Stage       (if applicable):

• Ultra-precise control to achieve surface roughness Ra   < 0.005 µm.

• Monitor real-time thickness sensor data (e.g.,      laser interferometer).

• Machine automatically stops at the target thickness.

• Error handling:      If vibration or temperature alarms trigger, pause operation and inspect:

• Wheel balance

• Coolant flow

Step 4: Wafer Unloading and Cleaning

• After processing, wafers are automatically cleaned and   transferred to the DFM2800 or the load port cassette via T-arm or robot.

3. Safety and Maintenance Guidelines

3.1 Safe Operation

• Wear ESD protective clothing.

• Do not open protective covers while the machine is running.

• In an emergency, press the E-Stop (red button).

3.2 Routine Maintenance

• Daily:

• Clean worktable

• Check air/water pressure and flow

• Check remaining wheel thickness

• Weekly:

• Calibrate height gauge

• Check wafer surface roughness

• Monthly:

• Replace vacuum filters

• Lubricate mechanical guide rails

4. Critical Notes

4.1 Grinding Wheel Management

• New wheels must be height-calibrated and corrected.

• Perform regular dressing to maintain wheel performance.

4.2 Wafer Breakage Prevention

• For ultra-thin wafers (<100 µm), use special  cassettes or inline handling.

• After grinding, immediately apply support tape   (e.g., peelable adhesive tape) to prevent warping or breakage.

4.3 Data Logging

• Equipment automatically saves log files for each run (thickness, process time).

• Surface roughness must be measured using dedicated metrology tools for traceability.

5. Shutdown Procedure

1. Ensure spindle stops before shutdown (warm-up stop  if active).

2. Turn off main power, and close water and air  alves.