DISCO DGP 8761 T2 Pad Porous Resin Wafer Transportation Pad Chuck For ultra thin wafer handling

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DISCO DGP 8761 T2 Pad Porous Resin Wafer Transportation Pad Chuck For ultra thin wafer handling

Home > Products > Porous Ceramic Vacuum Chuck Table > DISCO DGP 8761 T2 Pad Porous Resin Wafer Transportation Pad Chuck For ultra thin wafer handling

DISCO DGP 8761 T2 Pad Porous Resin Wafer Transportation Pad Chuck For ultra thin wafer handling

DISCO DGP 8761 T2 Pad Porous Resin Wafer Transportation Pad Chuck For ultra thin wafer handling

DISCO DGP 8761 T2 Pad Porous Resin Wafer Transportation Pad Chuck For ultra thin wafer handling 

SEMIXICON CERAMERIC
Soft chucking for ultra thin and fragile semiconductor wafer