CERAMERIC SEMIXICON

Precision Machining of Advanced Ceramics for Semiconductor Applications

At CERAMERIC SEMIXICON, we specialize in the precision engineering of advanced ceramic components designed for the most demanding semiconductor environments. Materials such as silicon carbide (SiC) and silicon nitride (SiN) are at the core of next-generation wafer processing and power electronics systems due to their exceptional material properties.

These ceramics combine high thermal conductivity, low thermal expansion, excellent corrosion resistance, and superior mechanical strength, making them ideal for applications including wafer handling, power module substrates, and high-temperature structural components.

Addressing the Machining Challenge

The same properties that make SiC and SiN highly attractive also make them extremely difficult to machine. Conventional machining methods often result in:

• Rapid tool wear

• Edge chipping and microcracks

• Limited precision for complex geometries

At CERAMERIC SEMIXICON, we overcome these limitations through advanced non-contact machining technologies, enabling high-precision fabrication without compromising material integrity.

Advanced Laser-Based Processing Capabilities

We utilize state-of-the-art laser machining technologies, including water-jet-guided laser (WJL) processing, to deliver superior performance in machining hard and brittle ceramics.

Key Technical Advantages

Ultra-Precision Edge Quality

• Near-vertical cutting edges: 90° ± 1°

• Minimal edge defects and no burr formation

• Reduced or eliminated post-processing

Low Thermal Impact

• Integrated water-jet cooling minimizes heat-affected zones

• Preserves intrinsic material properties

High Aspect Ratio & Fine Features

• Kerf widths as small as 30–100 µm

• Aspect ratios exceeding 100:1

• Complex geometries with tight tolerances (±30 µm)

Non-Contact, Wear-Free Processing

• No tool degradation

• High repeatability and process stability

Enabling Complex Ceramic Components

Our machining capabilities extend beyond simple cutting to include:

• Precision drilling and micro-holes

• Pocketing and blind structures

• Free-form and high-complexity geometries

This allows CERAMERIC SEMIXICON to deliver fully customized ceramic solutions tailored to advanced semiconductor equipment requirements.

Applications in Semiconductor Manufacturing

Our SiC and SiN components are widely used in:

• Wafer handling systems (pin chucks, electrostatic chucks, carriers)

• Semiconductor process equipment (heaters, supports, fixtures)

• Power electronics modules (substrates, insulating structures)

• High-temperature and corrosive environments

With ultra-high flatness, dimensional stability, and wear resistance, our components directly contribute to improved process yield, precision, and equipment lifetime.

Commitment to Innovation

CERAMERIC SEMIXICON continuously invests in advanced manufacturing technologies to meet the evolving demands of semiconductor fabrication, including AI, power electronics, and next-generation packaging.

By combining material expertise with precision laser processing, we enable our customers to fully leverage the performance advantages of advanced ceramics—without compromise.